This article is presented under your auspices Master of Bond.
Master Bond EP112 It is a low -temperature epoxy system, electrical insulation, composed of two curable components, designed for applications that require visual and resistant chemicals used commonly used to treat silicone. This article presents a case of two parts that include the manufacture of small electronics, which displays the role of EP112 in connecting the silicon chip to the glass substrate.
Part 1: The start and the role of EP112
In the first part of this case study, researchers at Lawrence Livemore National Laboratory (llnl) developed an innovative operation on silicone on SOI called Start (silicone transfer to the arbitrary substrate). This method allows the conversion of standard bulmal silicone chips with complete circuits into SOI -like formations without a significant increase in manufacturing costs. Using traditional manufacturing technologies, the start of the benefits of loose silicone electronics combines the SOI technology while maintaining cost efficiency.
A decisive step in this process includes connecting the silicon chip of the glass support pillar. EP112 was chosen as an adhesive for selection due to her very low wife, strong bonding capabilities, and high chemical resistance. The slave structure ultimately contributed to the successful development of the liquid liquid display (LCD), indicating the effectiveness of the EP112 in the manufacture of accurate electronics.
Part 2: Cmos Sensing the chip to resist SEU
In the second part of this study, the LLNL researchers applied EP112 in a new process of photographing the chip to enhance the reliability of the integrated CMOS (ICS) circles. The goal was to reduce exposure to individual disorders (SEUS) by significantly reducing the size of the charge collection within the silicone pillar.
To achieve this, the EP112 was used to connect two pillars together, ensuring a safe connection through the marrow steps. The process included a high -temperature alkaline drilling step, as the superior chemical resistance of EP112 played a decisive role in preventing the disposal of interconnection. By maintaining structural integrity under these harsh conditions, EP112 enabled successfully completing the mitigation process, indicating how suitable for advanced semiconductor applications.
To read more about the major parameters and requirements, and get to know the results, please Download the full case study here.
